LY-11PM (Aluminum Hydroxide)

The low-sodium product has a particle size of 1.7–2.2 μm, with uniform particle size distribution, intact crystal morphology, high crystallinity, a bimodal primary particle size distribution, excellent thermal stability, and outstanding dispersibility. Sodium content: 0.053%. Low sodium content, high whiteness, low electrical conductivity, low oil absorption, low impurity content, excellent compatibility and dispersibility with polymer materials, high processing flowability, and capable of achieving outstanding high-temperature resistance and flame-retardant performance.

Keywords:

Physical filtration, ion exchange, membrane filtration, storage systems, auxiliary systems

Product Description

Product Grade

Particle size index (um)

Ingredient Content (%)

Whiteness Wt

Density (g/cm³)

Oil absorption value ml/100g

Electrical conductivity µS/cm

pH value

Note

D10

D50

D90

D97

D100

SiO 2

Fe 2 O 3

No 2 O

Loss on ignition

Alkaline additive

Loose packing

Re-armor

LY-11PM

0.834

1.972

4.284

5.86

11.51

0.006

0.005

0.053

34.47

0.001

98.79

0.43

0.83

28

42.2

9.23

Low-sodium product

 

  LY-11PM (Aluminum Hydroxide)

 

▲ Particle size distribution of LY-11PM product; ▲ SEM image of LY-11PM product

Product features:

● The low-sodium product has a particle size of 1.7–2.2 μm, with uniform particle size, intact crystal morphology, high crystallinity, a dual distribution of primary crystal sizes, excellent thermal stability, and outstanding dispersibility.

● Sodium content: 0.053%. Low sodium content, high whiteness, low electrical conductivity, relatively low oil absorption, low impurity content, excellent compatibility with polymer materials, good dispersibility, high processing flowability, and capable of achieving outstanding high-temperature resistance and flame-retardant performance.

Product application areas:

● As a novel inorganic flame retardant, it can be used in industries such as wires and cables, flame-retardant building materials, rubber, and foaming materials.

● Excellent heat resistance, suitable for use as a filler in copper-clad laminates.

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